Sputtering Targets

Sputtering Targets

Sputtering targets are materials used in the sputtering process to deposit thin films onto substrates. They comprise metals, alloys, ceramics, or composites. During sputtering, high-energy ions hit the target, dislodging atoms that then deposit onto the substrate. Metal targets produce conductive films, ceramic targets yield tailored properties, and composites offer unique characteristics. Magnetic targets are used for magnetic films. With sputtering targets, researchers and industries achieve precise, high-quality thin films for various applications.
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: 1 Ea. : 7440-06-4. : Disc. : 99.99%
: Tungsten sputtering target. : 76.2mm (3.0 in.) dia. x 6.35mm (0.250 in.) thick : 1 Ea. : 7440-33-7.
: Copper sputtering target. : 50.8mm (2.0 in.) dia. x 3.18mm (0.125 in.) thick : 1 Ea. : 7440-50-8.
: Copper sputtering target. : 50.8mm (2.0 in.) dia. x 6.35mm (0.250 in.) thick : 1 Ea. : 7440-50-8.
: Titanium sputtering target. : 50.8mm (2.0 in.) dia. x 3.18mm (0.125 in.) thick : 1 Ea. : 7440-32-6.
: Titanium sputtering target. : 76.2mm (3.0 in.) dia. x 3.18mm (0.125 in.) thick : 1 Ea. : 7440-32-6.
: 1 Ea. : 7440-05-3. : Pd. : 99.99%
: Cobalt sputtering target. : 50.8mm (2.0 in.) dia. x 3.18mm (0.125 in.) thick : 1 Ea. : 7440-48-4.
: Cobalt sputtering target. : 50.8mm (2.0 in.) dia. x 6.35mm (0.250 in.) thick : 1 Ea. : 7440-48-4.
: Copper sputtering target. : 76.2mm (3.0 in.) dia. x 3.18mm (0.125 in.) thick : 1 Ea. : 7440-50-8.
: Copper sputtering target. : 76.2mm (3.0 in.) dia. x 6.35mm (0.250 in.) thick : 1 Ea. : 7440-50-8.
: Iron sputtering target. : 50.8mm (2.0 in.) dia. x 3.18mm (0.125 in.) thick : 1 Ea. : 7439-89-6.
: Manganese sputtering target. : 76.2mm (3.0 in.) dia. x 3.18mm (0.125 in.) thick : 1 Ea. : 7439-96-5.
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